Abstract: Multi-layered stacks are commonly used in microelectronic packaging. Traditionally, these systems are designed using linear-elastic analysis either with analytical solutions or finite element method. ...

Abstract: An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with ...

Abstract: Due to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the solder joint experiences cycling shear strain, which leads to short cycle fatigue. When semiconductor ...

Abstract: A new experimental method utilizing the Interferometric Strain/Slope Rosette (ISSR) and incremental hole-drilling is applied to measure in-plane residual stresses which vary with depth. For each ...

Abstract: Three-dimensional elastic-plastic rolling contact stress analysis was conducted incorporating elastic and plastic shakedown concepts. The Hertzian distribution was assumed for the normal surface ...

Abstract: This paper studies how temperature variations affect natural frequencies of rocking vibration of a rotating disk and spindle system through mathematical modeling and experimental measurements. ...

Abstract: Brush seals have proven to be an attractive alternative to labyrinth seals for turbomachinery applications. This innovation in seal technology utilizes both the high temperature capability of ...