Abstract: This paper reviews recent progress in the development of silicon-based vapor chambers for heat spreading in electronic packages. Effective hotspot mitigation is an increasingly challenging issue in electronics thermal ...

Abstract: Silicononinsulator (SOI) technology has sparked advances in semiconductor and MEMs manufacturing and revolutionized our ability to study phonon transport phenomena by providing singlecrystal silicon layers with thickness ...

Abstract: A virtual testbed simulation framework is created for the economic, reliability, and lifetime analysis of battery thermal management control strategies in electric vehicles (EVs). The system-level model is created in the ...

Abstract: High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ...

Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...

Abstract: Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ...

Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...

Abstract: InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge ...

Abstract: Silicon films of submicrometer thickness play a central role in many advanced technologies for computation and energy conversion. Numerous thermal conductivity data for silicon films are available in the literature, but ...

Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...