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    Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 003:;page 31024
    Author(s): Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The forced cooled electronic chassis is revisited and, because of recent developments, changes which amend the design procedure are proposed. These considerations involve the thickness of the ...
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    Sixty-Five Years of Extended Surface Technology (1922–1987) 

    Source: Applied Mechanics Reviews:;1988:;volume( 041 ):;issue: 009:;page 321
    Author(s): Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The extended surface literature from 1922 to 1987 is reviewed. The review begins with the classic NACA report of Harper and Brown published in 1922 and concludes with the works of Marto, ...
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    Transient Heat Transfer in Extended Surfaces 

    Source: Applied Mechanics Reviews:;1995:;volume( 048 ):;issue: 007:;page 317
    Author(s): A. Aziz; Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper attempts to provide a comprehensive, coherent, and methodical review of the existing literature on the transient performance of extended surfaces (fins). With the exception of very ...
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    The Case for the Elliptical Spine 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 217
    Author(s): Gerald L. McIntyre; Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The spine (fin) efficiency is abandoned and the input admittance, defined as the ratio of the heat dissipated by the spine to the temperature excess at the spine base, is established as the ...
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    Design of Optimum Plate-Fin Natural Convective Heat Sinks 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 208
    Author(s): Avram Bar-Cohen; Madhusudan Iyengar; Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced ...
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    Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002:;page 162
    Author(s): Avram Bar-Cohen; editor; Peter A. Engel; Allan D. Kraus; editor
    Publisher: The American Society of Mechanical Engineers (ASME)
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