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    Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling 

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003:;page 031001-1
    Author(s): Kasukurthy, Rajesh; Rachakonda, Amruthavalli; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Data centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on ...
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    Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 001:;page 011011-1
    Author(s): Misrak, Abel; Chauhan, Tushar; Rajmane, Pavan; Bhandari, Rabin; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal interface materials (TIMs) are an important component in electronic packaging, and there is a concerted effort to understand their reliability when used under various environmental load conditions. Previous researchers ...
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    Effect of Through Silicon Via Joule Heating on Device Performance for Low Powered Mobile Applications 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004:;page 41008
    Author(s): Mirza, Fahad; Naware, Gaurang; Jain, Ankur; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Threedimensional (3D) throughsiliconvia (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous ...
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    Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31003
    Author(s): Shah, Jimil M.; Misrak, Abel; Agonafer, Dereje; Kaler, Mike
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: Contamination due to the use of airside economizer has become a major issue that cost companies revenue. This issue will continue to rise as server components become smaller, densely packed, and as companies move into more ...
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    Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 002
    Author(s): Awe, Oluwaseun; Shah, Jimil M.; Agonafer, Dereje; Singh, Prabjit; Kannan, Naveen; Kaler, Mike
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Airside economizers lower the operating cost of data centers by reducing or eliminating mechanical cooling. It, however, increases the risk of reliability degradation of information technology (IT) equipment due to ...
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    Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 24501-1
    Author(s): Saini, Satyam; Shahi, Pardeep; Bansode, Pratik; Shah, Jimil M.; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce ...
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    Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004:;page 41008-1
    Author(s): Shahi, Pardeep; Deshmukh, Apruv Pravin; Hurnekar, Hardik Yashwant; Saini, Satyam; Bansode, Pratik; Kasukurthy, Rajesh; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transistor density trends till recently have been following Moore's law, doubling every generation resulting in increased power density. The computational performance gains with the breakdown of Moore's law were achieved ...
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    Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 001:;page 011010-1
    Author(s): Bansode, Pratik V.; Shah, Jimil M.; Gupta, Gautam; Agonafer, Dereje; Patel, Harsh; Roe, David; Tufty, Rick
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The next radical change in the thermal management of data centers is to shift from conventional cooling methods like air-cooling to direct liquid cooling to enable high thermal mass and corresponding superior cooling. There ...
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    Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041103-1
    Author(s): Shah, Jimil M.; Anand, Roshan; Singh, Prabjit; Saini, Satyam; Cyriac, Rawhan; Agonafer, Dereje; Kaler, Mike
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A remarkable amount of energy in data centers is consumed in eliminating the heat generated by the information technology (IT) equipment to maintain and ensure safe operating conditions and optimum performance. The ...
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    Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling 

    Source: Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 002:;page 21109-1
    Author(s): Shah, Jimil M.; Padmanaban, Keerthivasan; Singh, Hrishabh; Duraisamy Asokan, Surya; Saini, Satyam; Agonafer, Dereje
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The adoption of single-phase liquid immersion cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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