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    Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 354
    Author(s): A.-F. Bastawros; K.-S. Kim
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The time dependent temperature distribution induced by electric current heating in a double edge cracked, unpassivated thin aluminum or gold film interconnect lines is monitored using a high ...
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    Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moiré Interferometry 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004:;page 303
    Author(s): A. F. Bastawros; A. S. Voloshin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fractional Fringe Moiré Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced ...
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    Mechanistic Understanding of Material Detachment During Micro-Scale Polishing 

    Source: Journal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 004:;page 731
    Author(s): W. Che; A-F. Bastawros; Y. Guo; A. Chandra
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A combined experimental and modeling approach has been devised to understand the material removal mechanism during abrasion of ductile copper discs. First, single grit scratch intersection experiments ...
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