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    Mobility Analysis and Type Identification of Four-Link Mechanisms 

    Source: Journal of Mechanical Design:;1994:;volume( 116 ):;issue: 002:;page 629
    Author(s): A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An alternative derivation of the simple criteria, in terms of linkage parameters, demarking the zones of nonexistence of double-crank and crank-rocker RSSR mechanisms is presented. The existence ...
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    Use of Dynamic Absorbers to Control Parametric Instabilities of a Pipe 

    Source: Journal of Applied Mechanics:;1978:;volume( 045 ):;issue: 004:;page 949
    Author(s): K. Singh; A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001:;page 75
    Author(s): A. K. Mallik; G. P. Peterson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, ...
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    Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001:;page 82
    Author(s): G. P. Peterson; A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The transient thermal response of vapor deposited micro heat pipe arrays fabricated as an integral part of silicon wafers was measured to determine if these arrays could be used to reduce the ...
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    Forward and Inverse Analyses of an SMA Actuated Compliant Link 

    Source: Journal of Mechanisms and Robotics:;2011:;volume( 003 ):;issue: 002:;page 21003
    Author(s): A. Banerjee; B. Bhattacharya; A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents forward and inverse analyses of the response of a compliant link actuated by a discretely attached shape memory alloy (SMA) wire subjected to a time-varying input voltage. ...
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    Forced Nonlinear Oscillations of an Autoparametric System—Part 2: Chaotic Responses 

    Source: Journal of Applied Mechanics:;1983:;volume( 050 ):;issue: 003:;page 663
    Author(s): H. Hatwal; A. K. Mallik; A. Ghosh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Chaotic oscillations arising in forced oscillations of a two degree-of-freedom autoparametric system are studied. Statistical analysis of the numerically integrated nonperiodic responses is shown ...
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    Forced Nonlinear Oscillations of an Autoparametric System—Part 1: Periodic Responses 

    Source: Journal of Applied Mechanics:;1983:;volume( 050 ):;issue: 003:;page 657
    Author(s): H. Hatwal; A. K. Mallik; A. Ghosh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Forced oscillations of a two degree-of-freedom autoparametric system are studied with moderately high excitations. The approximate results obtained by the method of harmonic balance are found to ...
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    Optimum Discrete Location of Shape Memory Alloy Wire for Enhanced Actuation of a Compliant Link 

    Source: Journal of Mechanical Design:;2010:;volume( 132 ):;issue: 002:;page 21001
    Author(s): A. Banerjee; B. Bhattacharya; A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: For discrete actuation with shape memory alloy (SMA) wires, the actuation moment can be controlled by changing the amount of wire offset. Increasing offset not only enhances the actuating moment, ...
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    Free Vibration of Thin-Walled Open Section Beams With Unconstrained Damping Treatment 

    Source: Journal of Applied Mechanics:;1981:;volume( 048 ):;issue: 001:;page 169
    Author(s): S. Narayanan; J. P. Verma; A. K. Mallik
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Free-vibration characteristics of a thin-walled, open cross-section beam, with unconstrained damping layers at the flanges, are investigated. Both uncoupled transverse vibration and the coupled ...
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    On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004:;page 436
    Author(s): A. K. Mallik; G. P. Peterson; M. H. Weichold
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A transient three-dimensional numerical model was developed to determine the potential advantages of constructing an array of very small (100 μm diameter) heat pipes as an integral part of ...
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