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Now showing items 11-20 of 33
Hydraulic Efficiency in RANS of the Flow in Multichambered Contactors
Publisher: American Society of Civil Engineers
Abstract: Accurate and practical models are in demand for optimization of ozone contactor designs. This paper reports results from Reynolds-averaged Navier-Stokes simulation (RANS) of the flow and passive nonreactive tracer transport ...
Concessionaire Selection for Build-Operate-Transfer Tunnel Projects in Hong Kong
Publisher: American Society of Civil Engineers
Abstract: A significant realignment of risks between project participants is a fundamental facet of the new procurement paradigm of BOT (build-operate-transfer). A BOT concessionaire assumes far more and deeper risks than a contractor. ...
Optimal Design of Triangular Arches against Buckling
Publisher: ASCE
Abstract: This paper is concerned with the optimal design of triangular arches of a given volume of material for maximum buckling capacity. The buckling criteria of triangular arches are derived analytically by using stability ...
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In microelectronic industry, thin polymer layers are one of the more commonly used product constituents. Examples are glue layers, coatings, and dielectric layers. The thicknesses of these films ...
Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SiLK is a polymer material developed for use as a thin-film dielectric in the interconnect structure of high-density integrated circuits. Among others, its thermomechanical properties play a ...
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties ...
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected ...
Response Surface Modeling for Nonlinear Packaging Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...
Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board ...
Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding ...