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    Active Cooling System for Downhole Electronics in High-Temperature Environments

    Source: Journal of Thermal Science and Engineering Applications:;2022:;volume( 014 ):;issue: 008::page 81009-1
    Author:
    Wei, Minghui
    ,
    Cai, Wei
    ,
    Xu, Mingze
    ,
    Deng, Shuang
    DOI: 10.1115/1.4053120
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Downhole high-temperature environment is an important factor affecting the performance of downhole electronic system. At present, various active cooling technologies and passive cooling technologies have been proposed to reduce the temperature of downhole electric circuit system. However, passive cooling technologies can only provide limited cooling capacity for drilling tools under high-temperature environment, and the duration of cooling is short, which cannot meet the long-time drilling task. This paper presents an active cooling system (ACS) for downhole electronics and the effects of different temperatures on the performance of electronic components are analyzed. The ACS mainly includes a micro supercharger, condenser tube, evaporation pipe, capillary tube, and refrigerant. The theoretical analysis of heat transfer and refrigerant capacity in high-temperature environment is carried out. The thermal characteristics of the ACS are evaluated experimentally. The results show that the temperature of electronic components can be reduced to below 163 °C in the 200 °C downhole environment and components. The geomagnetic field data measured by electronic components at room temperature, 200 °C and with ACS are compared. The results show that ACS can keep electronic components working normally.
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      Active Cooling System for Downhole Electronics in High-Temperature Environments

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/4284441
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    • Journal of Thermal Science and Engineering Applications

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    contributor authorWei, Minghui
    contributor authorCai, Wei
    contributor authorXu, Mingze
    contributor authorDeng, Shuang
    date accessioned2022-05-08T08:52:14Z
    date available2022-05-08T08:52:14Z
    date copyright1/12/2022 12:00:00 AM
    date issued2022
    identifier issn1948-5085
    identifier othertsea_14_8_081009.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284441
    description abstractDownhole high-temperature environment is an important factor affecting the performance of downhole electronic system. At present, various active cooling technologies and passive cooling technologies have been proposed to reduce the temperature of downhole electric circuit system. However, passive cooling technologies can only provide limited cooling capacity for drilling tools under high-temperature environment, and the duration of cooling is short, which cannot meet the long-time drilling task. This paper presents an active cooling system (ACS) for downhole electronics and the effects of different temperatures on the performance of electronic components are analyzed. The ACS mainly includes a micro supercharger, condenser tube, evaporation pipe, capillary tube, and refrigerant. The theoretical analysis of heat transfer and refrigerant capacity in high-temperature environment is carried out. The thermal characteristics of the ACS are evaluated experimentally. The results show that the temperature of electronic components can be reduced to below 163 °C in the 200 °C downhole environment and components. The geomagnetic field data measured by electronic components at room temperature, 200 °C and with ACS are compared. The results show that ACS can keep electronic components working normally.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleActive Cooling System for Downhole Electronics in High-Temperature Environments
    typeJournal Paper
    journal volume14
    journal issue8
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4053120
    journal fristpage81009-1
    journal lastpage81009-8
    page8
    treeJournal of Thermal Science and Engineering Applications:;2022:;volume( 014 ):;issue: 008
    contenttypeFulltext
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