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contributor authorWei, Minghui
contributor authorCai, Wei
contributor authorXu, Mingze
contributor authorDeng, Shuang
date accessioned2022-05-08T08:52:14Z
date available2022-05-08T08:52:14Z
date copyright1/12/2022 12:00:00 AM
date issued2022
identifier issn1948-5085
identifier othertsea_14_8_081009.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284441
description abstractDownhole high-temperature environment is an important factor affecting the performance of downhole electronic system. At present, various active cooling technologies and passive cooling technologies have been proposed to reduce the temperature of downhole electric circuit system. However, passive cooling technologies can only provide limited cooling capacity for drilling tools under high-temperature environment, and the duration of cooling is short, which cannot meet the long-time drilling task. This paper presents an active cooling system (ACS) for downhole electronics and the effects of different temperatures on the performance of electronic components are analyzed. The ACS mainly includes a micro supercharger, condenser tube, evaporation pipe, capillary tube, and refrigerant. The theoretical analysis of heat transfer and refrigerant capacity in high-temperature environment is carried out. The thermal characteristics of the ACS are evaluated experimentally. The results show that the temperature of electronic components can be reduced to below 163 °C in the 200 °C downhole environment and components. The geomagnetic field data measured by electronic components at room temperature, 200 °C and with ACS are compared. The results show that ACS can keep electronic components working normally.
publisherThe American Society of Mechanical Engineers (ASME)
titleActive Cooling System for Downhole Electronics in High-Temperature Environments
typeJournal Paper
journal volume14
journal issue8
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4053120
journal fristpage81009-1
journal lastpage81009-8
page8
treeJournal of Thermal Science and Engineering Applications:;2022:;volume( 014 ):;issue: 008
contenttypeFulltext


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