| contributor author | Teshima, Hiromasa | |
| contributor author | Kojima, Kohei | |
| contributor author | Ju, Yang | |
| date accessioned | 2017-05-09T01:06:55Z | |
| date available | 2017-05-09T01:06:55Z | |
| date issued | 2014 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_136_04_044501.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/154509 | |
| description abstract | Throughhole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical deposition. The mechanical and electrical performances of Cu nanowire surface fastener (NSF) were realized by the interconnection of Cu nanowire arrays. The shear and normal bonding strengths for the Cu NSF with 40 nm diameter nanowires were 3.38 أ— 10−3 and 2.46 أ— 10−3 N/cm2, respectively, and the parasitic resistance of it was approximately 22.5 خ©â€‰آ·â€‰cm2. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener | |
| type | Journal Paper | |
| journal volume | 136 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4028316 | |
| journal fristpage | 44501 | |
| journal lastpage | 44501 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004 | |
| contenttype | Fulltext | |