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contributor authorTeshima, Hiromasa
contributor authorKojima, Kohei
contributor authorJu, Yang
date accessioned2017-05-09T01:06:55Z
date available2017-05-09T01:06:55Z
date issued2014
identifier issn1528-9044
identifier otherep_136_04_044501.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154509
description abstractThroughhole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical deposition. The mechanical and electrical performances of Cu nanowire surface fastener (NSF) were realized by the interconnection of Cu nanowire arrays. The shear and normal bonding strengths for the Cu NSF with 40 nm diameter nanowires were 3.38 أ— 10−3 and 2.46 أ— 10−3 N/cm2, respectively, and the parasitic resistance of it was approximately 22.5 خ©â€‰آ·â€‰cm2.
publisherThe American Society of Mechanical Engineers (ASME)
titleFabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
typeJournal Paper
journal volume136
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028316
journal fristpage44501
journal lastpage44501
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004
contenttypeFulltext


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