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    Application of Carbon Nanotubes to Thermal Interface Materials

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002::page 20902
    Author:
    Drazen Fabris
    ,
    Patrick Wilhite
    ,
    Cary Y. Yang
    ,
    Toshishige Yamada
    ,
    Michael Rosshirt
    ,
    Christopher Cardenas
    DOI: 10.1115/1.4003864
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers and a matrix that allows for good surface wetting and compliance of the material during application. Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are tested using an in-house apparatus that allows for the simultaneous measurement of temperature, pressure, heat flux, and TIM thickness. Results show that addition of large quantities of CNTs degrades the performance of the commercial TIM, while the CNT-silicone oil mixtures showed improved performance at high pressures. Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures.
    keyword(s): Pressure , Carbon nanotubes , Mixtures , Thickness , Thermal conductivity , Thermal resistance AND Arctic region ,
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      Application of Carbon Nanotubes to Thermal Interface Materials

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    https://yetl.yabesh.ir/yetl1/handle/yetl/145797
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    contributor authorDrazen Fabris
    contributor authorPatrick Wilhite
    contributor authorCary Y. Yang
    contributor authorToshishige Yamada
    contributor authorMichael Rosshirt
    contributor authorChristopher Cardenas
    date accessioned2017-05-09T00:43:10Z
    date available2017-05-09T00:43:10Z
    date copyrightJune, 2011
    date issued2011
    identifier issn1528-9044
    identifier otherJEPAE4-26313#020902_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145797
    description abstractImprovements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers and a matrix that allows for good surface wetting and compliance of the material during application. Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are tested using an in-house apparatus that allows for the simultaneous measurement of temperature, pressure, heat flux, and TIM thickness. Results show that addition of large quantities of CNTs degrades the performance of the commercial TIM, while the CNT-silicone oil mixtures showed improved performance at high pressures. Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleApplication of Carbon Nanotubes to Thermal Interface Materials
    typeJournal Paper
    journal volume133
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4003864
    journal fristpage20902
    identifier eissn1043-7398
    keywordsPressure
    keywordsCarbon nanotubes
    keywordsMixtures
    keywordsThickness
    keywordsThermal conductivity
    keywordsThermal resistance AND Arctic region
    treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian