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contributor authorDrazen Fabris
contributor authorPatrick Wilhite
contributor authorCary Y. Yang
contributor authorToshishige Yamada
contributor authorMichael Rosshirt
contributor authorChristopher Cardenas
date accessioned2017-05-09T00:43:10Z
date available2017-05-09T00:43:10Z
date copyrightJune, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26313#020902_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145797
description abstractImprovements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers and a matrix that allows for good surface wetting and compliance of the material during application. Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are tested using an in-house apparatus that allows for the simultaneous measurement of temperature, pressure, heat flux, and TIM thickness. Results show that addition of large quantities of CNTs degrades the performance of the commercial TIM, while the CNT-silicone oil mixtures showed improved performance at high pressures. Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures.
publisherThe American Society of Mechanical Engineers (ASME)
titleApplication of Carbon Nanotubes to Thermal Interface Materials
typeJournal Paper
journal volume133
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4003864
journal fristpage20902
identifier eissn1043-7398
keywordsPressure
keywordsCarbon nanotubes
keywordsMixtures
keywordsThickness
keywordsThermal conductivity
keywordsThermal resistance AND Arctic region
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
contenttypeFulltext


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