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    A Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes

    Source: Journal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 002::page 21009
    Author:
    Hyunho Shin
    ,
    Jong-Bong Kim
    DOI: 10.1115/1.4000225
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A simple phenomenological constitutive model has been proposed to describe dynamic deformation behavior of various metals in wide strain rate, strain, and temperature regimes. The formulation of the model is, σ=[A+B{1−exp(−Cε)}][D ln(ε̇/ε̇0)+exp(E⋅ε̇/ε̇0)][1−(T−Tref)/(Tm−Tref)]m, where σ is the flow stress, ε is the strain, ε̇ is the strain rate, ε̇0 is the reference strain rate, T is the temperature, Tref is the reference temperature, Tm is the melting temperature, and A, B, C, D, E, and m are the material parameters. The proposed model successfully describes not only the linear rise of flow stress with logarithmic strain rate for many metals, but also the upturn of the flow stress at strain rate over about 104 s−1 for the case of copper. It can also describe the exponential increase in the flow stress with logarithmic strain rate for the case of tantalum, and is capable of predicting thermal softening of various metals at high as well as low temperature. The current model can be used for the practical simulation of many high-strain-rate events with improved precision and as a more rigorous comparison standard in the development of a physical model.
    keyword(s): Flow (Dynamics) , Temperature , Stress , Work hardening , Constitutive equations , Copper AND Deformation ,
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      A Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes

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    https://yetl.yabesh.ir/yetl1/handle/yetl/143354
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    • Journal of Engineering Materials and Technology

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    contributor authorHyunho Shin
    contributor authorJong-Bong Kim
    date accessioned2017-05-09T00:37:58Z
    date available2017-05-09T00:37:58Z
    date copyrightApril, 2010
    date issued2010
    identifier issn0094-4289
    identifier otherJEMTA8-27128#021009_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143354
    description abstractA simple phenomenological constitutive model has been proposed to describe dynamic deformation behavior of various metals in wide strain rate, strain, and temperature regimes. The formulation of the model is, σ=[A+B{1−exp(−Cε)}][D ln(ε̇/ε̇0)+exp(E⋅ε̇/ε̇0)][1−(T−Tref)/(Tm−Tref)]m, where σ is the flow stress, ε is the strain, ε̇ is the strain rate, ε̇0 is the reference strain rate, T is the temperature, Tref is the reference temperature, Tm is the melting temperature, and A, B, C, D, E, and m are the material parameters. The proposed model successfully describes not only the linear rise of flow stress with logarithmic strain rate for many metals, but also the upturn of the flow stress at strain rate over about 104 s−1 for the case of copper. It can also describe the exponential increase in the flow stress with logarithmic strain rate for the case of tantalum, and is capable of predicting thermal softening of various metals at high as well as low temperature. The current model can be used for the practical simulation of many high-strain-rate events with improved precision and as a more rigorous comparison standard in the development of a physical model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes
    typeJournal Paper
    journal volume132
    journal issue2
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.4000225
    journal fristpage21009
    identifier eissn1528-8889
    keywordsFlow (Dynamics)
    keywordsTemperature
    keywordsStress
    keywordsWork hardening
    keywordsConstitutive equations
    keywordsCopper AND Deformation
    treeJournal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 002
    contenttypeFulltext
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