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contributor authorHyunho Shin
contributor authorJong-Bong Kim
date accessioned2017-05-09T00:37:58Z
date available2017-05-09T00:37:58Z
date copyrightApril, 2010
date issued2010
identifier issn0094-4289
identifier otherJEMTA8-27128#021009_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143354
description abstractA simple phenomenological constitutive model has been proposed to describe dynamic deformation behavior of various metals in wide strain rate, strain, and temperature regimes. The formulation of the model is, σ=[A+B{1−exp(−Cε)}][D ln(ε̇/ε̇0)+exp(E⋅ε̇/ε̇0)][1−(T−Tref)/(Tm−Tref)]m, where σ is the flow stress, ε is the strain, ε̇ is the strain rate, ε̇0 is the reference strain rate, T is the temperature, Tref is the reference temperature, Tm is the melting temperature, and A, B, C, D, E, and m are the material parameters. The proposed model successfully describes not only the linear rise of flow stress with logarithmic strain rate for many metals, but also the upturn of the flow stress at strain rate over about 104 s−1 for the case of copper. It can also describe the exponential increase in the flow stress with logarithmic strain rate for the case of tantalum, and is capable of predicting thermal softening of various metals at high as well as low temperature. The current model can be used for the practical simulation of many high-strain-rate events with improved precision and as a more rigorous comparison standard in the development of a physical model.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Phenomenological Constitutive Equation to Describe Various Flow Stress Behaviors of Materials in Wide Strain Rate and Temperature Regimes
typeJournal Paper
journal volume132
journal issue2
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.4000225
journal fristpage21009
identifier eissn1528-8889
keywordsFlow (Dynamics)
keywordsTemperature
keywordsStress
keywordsWork hardening
keywordsConstitutive equations
keywordsCopper AND Deformation
treeJournal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 002
contenttypeFulltext


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