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    Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003::page 31011
    Author:
    E. Elsaadawy
    ,
    H. Mortazavi
    ,
    M. S. Hamed
    DOI: 10.1115/1.2912182
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Although the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used in such a problem. The accuracy of the computational predictions of heat transfer rates depends mostly on the choice of the proper turbulence model that is capable of capturing the physics of the problem, and on the corresponding wall treatment. The main objective of this work is to identify the proper turbulence model to be used in thermal analysis of electronic systems. A number of available turbulence models, namely, the standard k-ε, the renormalization group k-ε, the shear stress transport (SST), the k-ω, and the Reynolds stress models, have been investigated. The selection of the most appropriate turbulence model has been based upon comparisons with both direct numerical simulations (DNSs) and experimental results of other works. Based on such comparisons, the SST turbulence model has been found to produce results in very good agreement with the DNS and experimental results and hence it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging.
    keyword(s): Channels (Hydraulic engineering) , Turbulence , Stress , Shear (Mechanics) , Equations , Flow (Dynamics) , Forced convection AND Modeling ,
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      Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

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    https://yetl.yabesh.ir/yetl1/handle/yetl/137760
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    contributor authorE. Elsaadawy
    contributor authorH. Mortazavi
    contributor authorM. S. Hamed
    date accessioned2017-05-09T00:27:34Z
    date available2017-05-09T00:27:34Z
    date copyrightSeptember, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26287#031011_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137760
    description abstractAlthough the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used in such a problem. The accuracy of the computational predictions of heat transfer rates depends mostly on the choice of the proper turbulence model that is capable of capturing the physics of the problem, and on the corresponding wall treatment. The main objective of this work is to identify the proper turbulence model to be used in thermal analysis of electronic systems. A number of available turbulence models, namely, the standard k-ε, the renormalization group k-ε, the shear stress transport (SST), the k-ω, and the Reynolds stress models, have been investigated. The selection of the most appropriate turbulence model has been based upon comparisons with both direct numerical simulations (DNSs) and experimental results of other works. Based on such comparisons, the SST turbulence model has been found to produce results in very good agreement with the DNS and experimental results and hence it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleTurbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
    typeJournal Paper
    journal volume130
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2912182
    journal fristpage31011
    identifier eissn1043-7398
    keywordsChannels (Hydraulic engineering)
    keywordsTurbulence
    keywordsStress
    keywordsShear (Mechanics)
    keywordsEquations
    keywordsFlow (Dynamics)
    keywordsForced convection AND Modeling
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian