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contributor authorE. Elsaadawy
contributor authorH. Mortazavi
contributor authorM. S. Hamed
date accessioned2017-05-09T00:27:34Z
date available2017-05-09T00:27:34Z
date copyrightSeptember, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26287#031011_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137760
description abstractAlthough the problem of 2D ribbed channels has been studied heavily in the literature as a benchmark or basic case for cooling of electronic packing, there is still a contradiction in the literature about the suitable turbulence model that should be used in such a problem. The accuracy of the computational predictions of heat transfer rates depends mostly on the choice of the proper turbulence model that is capable of capturing the physics of the problem, and on the corresponding wall treatment. The main objective of this work is to identify the proper turbulence model to be used in thermal analysis of electronic systems. A number of available turbulence models, namely, the standard k-ε, the renormalization group k-ε, the shear stress transport (SST), the k-ω, and the Reynolds stress models, have been investigated. The selection of the most appropriate turbulence model has been based upon comparisons with both direct numerical simulations (DNSs) and experimental results of other works. Based on such comparisons, the SST turbulence model has been found to produce results in very good agreement with the DNS and experimental results and hence it is recommended as an appropriate turbulence model for thermal analysis of electronic packaging.
publisherThe American Society of Mechanical Engineers (ASME)
titleTurbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
typeJournal Paper
journal volume130
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2912182
journal fristpage31011
identifier eissn1043-7398
keywordsChannels (Hydraulic engineering)
keywordsTurbulence
keywordsStress
keywordsShear (Mechanics)
keywordsEquations
keywordsFlow (Dynamics)
keywordsForced convection AND Modeling
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003
contenttypeFulltext


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