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    Fundamental Performance Limits of Heatsinks

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002::page 221
    Author:
    David Watabe Copeland
    DOI: 10.1115/1.1569262
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Dedicated fan-duct-heatsink combinations have become a standard means of cooling computer processors. Most previous studies have considered optimization of fin geometry (pitch and thickness) with overall heatsink dimensions (width, height, length) fixed. The present study considers size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance. First, an ideal heatsink with infinite fin thermal conductivity is considered, providing simple power-law prediction of performance. Next, fins of finite thermal conductivity and thickness, as well as effects of developing flow are included in the analysis, permitting prediction and minimization of weight. Models of both levels of complexity can be used, previous to more detailed numerical and/or experimental studies, to design optimized heatsinks.
    keyword(s): Thermal conductivity , Weight (Mass) , Flow (Dynamics) , Fins , Pressure drop , Thickness , Dimensions , Cooling , Geometry , Optimization , Computers AND Ducts ,
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      Fundamental Performance Limits of Heatsinks

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    https://yetl.yabesh.ir/yetl1/handle/yetl/128226
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    contributor authorDavid Watabe Copeland
    date accessioned2017-05-09T00:09:54Z
    date available2017-05-09T00:09:54Z
    date copyrightJune, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26218#221_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128226
    description abstractDedicated fan-duct-heatsink combinations have become a standard means of cooling computer processors. Most previous studies have considered optimization of fin geometry (pitch and thickness) with overall heatsink dimensions (width, height, length) fixed. The present study considers size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance. First, an ideal heatsink with infinite fin thermal conductivity is considered, providing simple power-law prediction of performance. Next, fins of finite thermal conductivity and thickness, as well as effects of developing flow are included in the analysis, permitting prediction and minimization of weight. Models of both levels of complexity can be used, previous to more detailed numerical and/or experimental studies, to design optimized heatsinks.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFundamental Performance Limits of Heatsinks
    typeJournal Paper
    journal volume125
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1569262
    journal fristpage221
    journal lastpage225
    identifier eissn1043-7398
    keywordsThermal conductivity
    keywordsWeight (Mass)
    keywordsFlow (Dynamics)
    keywordsFins
    keywordsPressure drop
    keywordsThickness
    keywordsDimensions
    keywordsCooling
    keywordsGeometry
    keywordsOptimization
    keywordsComputers AND Ducts
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian