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contributor authorDavid Watabe Copeland
date accessioned2017-05-09T00:09:54Z
date available2017-05-09T00:09:54Z
date copyrightJune, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26218#221_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128226
description abstractDedicated fan-duct-heatsink combinations have become a standard means of cooling computer processors. Most previous studies have considered optimization of fin geometry (pitch and thickness) with overall heatsink dimensions (width, height, length) fixed. The present study considers size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance. First, an ideal heatsink with infinite fin thermal conductivity is considered, providing simple power-law prediction of performance. Next, fins of finite thermal conductivity and thickness, as well as effects of developing flow are included in the analysis, permitting prediction and minimization of weight. Models of both levels of complexity can be used, previous to more detailed numerical and/or experimental studies, to design optimized heatsinks.
publisherThe American Society of Mechanical Engineers (ASME)
titleFundamental Performance Limits of Heatsinks
typeJournal Paper
journal volume125
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1569262
journal fristpage221
journal lastpage225
identifier eissn1043-7398
keywordsThermal conductivity
keywordsWeight (Mass)
keywordsFlow (Dynamics)
keywordsFins
keywordsPressure drop
keywordsThickness
keywordsDimensions
keywordsCooling
keywordsGeometry
keywordsOptimization
keywordsComputers AND Ducts
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
contenttypeFulltext


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