Impact of Low Temperatures on Solder Joint FailuresSource: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002::page 135Author:Boris Mirman
DOI: 10.1115/1.1465431Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. In this experiment, the low temperatures caused high peeling stresses in the heel area of solder joints and, as usual, relatively low plastic shear strain (as compared with these strains at high temperatures). This fact suggests that the impact of solder peeling stresses on the solder failure is noticeably higher than is anticipated by applying the commonly used failure criteria.
keyword(s): Solders , Stress , Shear (Mechanics) , Low temperature , Failure AND Solder joints ,
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| contributor author | Boris Mirman | |
| date accessioned | 2017-05-09T00:07:12Z | |
| date available | 2017-05-09T00:07:12Z | |
| date copyright | June, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26203#135_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126618 | |
| description abstract | An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. In this experiment, the low temperatures caused high peeling stresses in the heel area of solder joints and, as usual, relatively low plastic shear strain (as compared with these strains at high temperatures). This fact suggests that the impact of solder peeling stresses on the solder failure is noticeably higher than is anticipated by applying the commonly used failure criteria. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Impact of Low Temperatures on Solder Joint Failures | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1465431 | |
| journal fristpage | 135 | |
| journal lastpage | 137 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Shear (Mechanics) | |
| keywords | Low temperature | |
| keywords | Failure AND Solder joints | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002 | |
| contenttype | Fulltext |