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    Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002::page 99
    Author:
    R. S. Whitelaw
    ,
    R. W. Neu
    ,
    D. T. Scott
    DOI: 10.1115/1.2792674
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The deformation behavior of two commercial lead-free solder alloys, Indalloy 227 (77.2Sn-20.0In-2.8Ag) and Castin alloy (96.2Sn-2.5Ag-0.8Cu-0.5Sb), over a range of strain rates (10−6 s−1 to 10−2 s−1 ), temperatures (–55°C to 125°C), and isothermal and thermomechanical cycling conditions is experimentally determined. The behavior of these two lead-free alloys is compared to that of 60Sn-40Pb solder. In order to minimize the number of experiments, yet capture the significant features of the deformation behavior and obtain the simple Norton power law constants, strain-rate jump tests are successfully used. This minimal test information is also shown to be sufficient to determine a complete set of material parameters for modern unified thermoviscoplastic models that can capture the dominant strain rate and temperature effects including the thermomechanical cycling behavior. As an exercise, the parameters for the Bodner-Partom model are determined for both lead-free alloys and predictions of thermomechanical cycling are shown.
    keyword(s): Deformation , Alloys , Lead-free solders , Solders , Temperature effects AND Temperature ,
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      Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/122013
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    • Journal of Electronic Packaging

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    contributor authorR. S. Whitelaw
    contributor authorR. W. Neu
    contributor authorD. T. Scott
    date accessioned2017-05-08T23:59:22Z
    date available2017-05-08T23:59:22Z
    date copyrightJune, 1999
    date issued1999
    identifier issn1528-9044
    identifier otherJEPAE4-26173#99_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122013
    description abstractThe deformation behavior of two commercial lead-free solder alloys, Indalloy 227 (77.2Sn-20.0In-2.8Ag) and Castin alloy (96.2Sn-2.5Ag-0.8Cu-0.5Sb), over a range of strain rates (10−6 s−1 to 10−2 s−1 ), temperatures (–55°C to 125°C), and isothermal and thermomechanical cycling conditions is experimentally determined. The behavior of these two lead-free alloys is compared to that of 60Sn-40Pb solder. In order to minimize the number of experiments, yet capture the significant features of the deformation behavior and obtain the simple Norton power law constants, strain-rate jump tests are successfully used. This minimal test information is also shown to be sufficient to determine a complete set of material parameters for modern unified thermoviscoplastic models that can capture the dominant strain rate and temperature effects including the thermomechanical cycling behavior. As an exercise, the parameters for the Bodner-Partom model are determined for both lead-free alloys and predictions of thermomechanical cycling are shown.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDeformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy
    typeJournal Paper
    journal volume121
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792674
    journal fristpage99
    journal lastpage107
    identifier eissn1043-7398
    keywordsDeformation
    keywordsAlloys
    keywordsLead-free solders
    keywordsSolders
    keywordsTemperature effects AND Temperature
    treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002
    contenttypeFulltext
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