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contributor authorR. S. Whitelaw
contributor authorR. W. Neu
contributor authorD. T. Scott
date accessioned2017-05-08T23:59:22Z
date available2017-05-08T23:59:22Z
date copyrightJune, 1999
date issued1999
identifier issn1528-9044
identifier otherJEPAE4-26173#99_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/122013
description abstractThe deformation behavior of two commercial lead-free solder alloys, Indalloy 227 (77.2Sn-20.0In-2.8Ag) and Castin alloy (96.2Sn-2.5Ag-0.8Cu-0.5Sb), over a range of strain rates (10−6 s−1 to 10−2 s−1 ), temperatures (–55°C to 125°C), and isothermal and thermomechanical cycling conditions is experimentally determined. The behavior of these two lead-free alloys is compared to that of 60Sn-40Pb solder. In order to minimize the number of experiments, yet capture the significant features of the deformation behavior and obtain the simple Norton power law constants, strain-rate jump tests are successfully used. This minimal test information is also shown to be sufficient to determine a complete set of material parameters for modern unified thermoviscoplastic models that can capture the dominant strain rate and temperature effects including the thermomechanical cycling behavior. As an exercise, the parameters for the Bodner-Partom model are determined for both lead-free alloys and predictions of thermomechanical cycling are shown.
publisherThe American Society of Mechanical Engineers (ASME)
titleDeformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy
typeJournal Paper
journal volume121
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792674
journal fristpage99
journal lastpage107
identifier eissn1043-7398
keywordsDeformation
keywordsAlloys
keywordsLead-free solders
keywordsSolders
keywordsTemperature effects AND Temperature
treeJournal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002
contenttypeFulltext


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