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    Review of Heat Transfer Technologies in Electronic Equipment

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004::page 333
    Author:
    L. T. Yeh
    DOI: 10.1115/1.2792113
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
    keyword(s): Heat transfer , Electronic equipment , Electronic systems , Failure , Thermal management , Air Force , Electronics , Temperature control , Reliability , Energy dissipation , Design AND Heat ,
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      Review of Heat Transfer Technologies in Electronic Equipment

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    https://yetl.yabesh.ir/yetl1/handle/yetl/115135
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    contributor authorL. T. Yeh
    date accessioned2017-05-08T23:46:53Z
    date available2017-05-08T23:46:53Z
    date copyrightDecember, 1995
    date issued1995
    identifier issn1528-9044
    identifier otherJEPAE4-26151#333_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115135
    description abstractThermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleReview of Heat Transfer Technologies in Electronic Equipment
    typeJournal Paper
    journal volume117
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792113
    journal fristpage333
    journal lastpage339
    identifier eissn1043-7398
    keywordsHeat transfer
    keywordsElectronic equipment
    keywordsElectronic systems
    keywordsFailure
    keywordsThermal management
    keywordsAir Force
    keywordsElectronics
    keywordsTemperature control
    keywordsReliability
    keywordsEnergy dissipation
    keywordsDesign AND Heat
    treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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