| contributor author | L. T. Yeh | |
| date accessioned | 2017-05-08T23:46:53Z | |
| date available | 2017-05-08T23:46:53Z | |
| date copyright | December, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26151#333_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115135 | |
| description abstract | Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Review of Heat Transfer Technologies in Electronic Equipment | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792113 | |
| journal fristpage | 333 | |
| journal lastpage | 339 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat transfer | |
| keywords | Electronic equipment | |
| keywords | Electronic systems | |
| keywords | Failure | |
| keywords | Thermal management | |
| keywords | Air Force | |
| keywords | Electronics | |
| keywords | Temperature control | |
| keywords | Reliability | |
| keywords | Energy dissipation | |
| keywords | Design AND Heat | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
| contenttype | Fulltext | |