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contributor authorL. T. Yeh
date accessioned2017-05-08T23:46:53Z
date available2017-05-08T23:46:53Z
date copyrightDecember, 1995
date issued1995
identifier issn1528-9044
identifier otherJEPAE4-26151#333_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/115135
description abstractThermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
publisherThe American Society of Mechanical Engineers (ASME)
titleReview of Heat Transfer Technologies in Electronic Equipment
typeJournal Paper
journal volume117
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792113
journal fristpage333
journal lastpage339
identifier eissn1043-7398
keywordsHeat transfer
keywordsElectronic equipment
keywordsElectronic systems
keywordsFailure
keywordsThermal management
keywordsAir Force
keywordsElectronics
keywordsTemperature control
keywordsReliability
keywordsEnergy dissipation
keywordsDesign AND Heat
treeJournal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004
contenttypeFulltext


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