| contributor author | R. H. Katyl | |
| contributor author | W. T. Pimbley | |
| date accessioned | 2017-05-08T23:38:06Z | |
| date available | 2017-05-08T23:38:06Z | |
| date copyright | September, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26132#336_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110052 | |
| description abstract | The analysis for equilibrium shapes of axial symmetric solder connections is presented, which includes the consideration of surface tension, external, and gravitation forces. Four methods of calculating the shapes are explained. The analysis and calculation methods are applied to molten solder drops in contact with wettable circular pads, and to controlled collapse interconnections. A discussion of planar arrays of nonidentical solder connections, and the control of connector shape and height by the use of such nonuniformity is included. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Shape and Force Relationships for Molten Axisymmetric Solder Connections | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905460 | |
| journal fristpage | 336 | |
| journal lastpage | 341 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Force | |
| keywords | Shapes | |
| keywords | Gravity (Force) | |
| keywords | Surface tension | |
| keywords | Drops | |
| keywords | Equilibrium (Physics) AND Collapse | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003 | |
| contenttype | Fulltext | |