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contributor authorR. H. Katyl
contributor authorW. T. Pimbley
date accessioned2017-05-08T23:38:06Z
date available2017-05-08T23:38:06Z
date copyrightSeptember, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26132#336_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110052
description abstractThe analysis for equilibrium shapes of axial symmetric solder connections is presented, which includes the consideration of surface tension, external, and gravitation forces. Four methods of calculating the shapes are explained. The analysis and calculation methods are applied to molten solder drops in contact with wettable circular pads, and to controlled collapse interconnections. A discussion of planar arrays of nonidentical solder connections, and the control of connector shape and height by the use of such nonuniformity is included.
publisherThe American Society of Mechanical Engineers (ASME)
titleShape and Force Relationships for Molten Axisymmetric Solder Connections
typeJournal Paper
journal volume114
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905460
journal fristpage336
journal lastpage341
identifier eissn1043-7398
keywordsSolders
keywordsForce
keywordsShapes
keywordsGravity (Force)
keywordsSurface tension
keywordsDrops
keywordsEquilibrium (Physics) AND Collapse
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003
contenttypeFulltext


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