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    An Interfacing Software Package for Thermal Analysis: Application to Microelectronics

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001::page 54
    Author:
    A. Hadim
    ,
    A. Chu
    ,
    A. Yskamp
    ,
    A. T. Chang
    DOI: 10.1115/1.3226509
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finite-difference thermal network analyzers for detailed analysis of complex thermal problems. The finite element mesh is used to generate the thermal network representation of the problem. INSTAN performs automatically the thermal network calculations and generates a complete input file for the thermal analysis program. The INSTAN software package is a powerful modeling tool which uses the preprocessing and postprocessing features available in a finite element program. It has also the flexibility and heat transfer calculation capabilities of a finite-difference program. It can handle problems with three-dimensional irregular geometries, time and temperature dependent properties, and anisotropic materials. The software possesses enhanced capabilities that make it suitable for thermal analysis of microelectronic equipment.
    keyword(s): Computer software , Thermal analysis , Microelectronic devices , Networks , Finite element analysis , Modeling , Plasticity , Temperature AND Heat transfer ,
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      An Interfacing Software Package for Thermal Analysis: Application to Microelectronics

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/105274
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    • Journal of Electronic Packaging

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    contributor authorA. Hadim
    contributor authorA. Chu
    contributor authorA. Yskamp
    contributor authorA. T. Chang
    date accessioned2017-05-08T23:29:46Z
    date available2017-05-08T23:29:46Z
    date copyrightMarch, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26106#54_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105274
    description abstractA software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finite-difference thermal network analyzers for detailed analysis of complex thermal problems. The finite element mesh is used to generate the thermal network representation of the problem. INSTAN performs automatically the thermal network calculations and generates a complete input file for the thermal analysis program. The INSTAN software package is a powerful modeling tool which uses the preprocessing and postprocessing features available in a finite element program. It has also the flexibility and heat transfer calculation capabilities of a finite-difference program. It can handle problems with three-dimensional irregular geometries, time and temperature dependent properties, and anisotropic materials. The software possesses enhanced capabilities that make it suitable for thermal analysis of microelectronic equipment.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Interfacing Software Package for Thermal Analysis: Application to Microelectronics
    typeJournal Paper
    journal volume111
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226509
    journal fristpage54
    journal lastpage60
    identifier eissn1043-7398
    keywordsComputer software
    keywordsThermal analysis
    keywordsMicroelectronic devices
    keywordsNetworks
    keywordsFinite element analysis
    keywordsModeling
    keywordsPlasticity
    keywordsTemperature AND Heat transfer
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
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    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian