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contributor authorA. Hadim
contributor authorA. Chu
contributor authorA. Yskamp
contributor authorA. T. Chang
date accessioned2017-05-08T23:29:46Z
date available2017-05-08T23:29:46Z
date copyrightMarch, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26106#54_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105274
description abstractA software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finite-difference thermal network analyzers for detailed analysis of complex thermal problems. The finite element mesh is used to generate the thermal network representation of the problem. INSTAN performs automatically the thermal network calculations and generates a complete input file for the thermal analysis program. The INSTAN software package is a powerful modeling tool which uses the preprocessing and postprocessing features available in a finite element program. It has also the flexibility and heat transfer calculation capabilities of a finite-difference program. It can handle problems with three-dimensional irregular geometries, time and temperature dependent properties, and anisotropic materials. The software possesses enhanced capabilities that make it suitable for thermal analysis of microelectronic equipment.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Interfacing Software Package for Thermal Analysis: Application to Microelectronics
typeJournal Paper
journal volume111
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226509
journal fristpage54
journal lastpage60
identifier eissn1043-7398
keywordsComputer software
keywordsThermal analysis
keywordsMicroelectronic devices
keywordsNetworks
keywordsFinite element analysis
keywordsModeling
keywordsPlasticity
keywordsTemperature AND Heat transfer
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
contenttypeFulltext


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