Abstract: A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, ...

Abstract: A new method is presented to compute the mechanical compliance and thermal stress in surface mount leads of arbitrary shape. It involves expressing the profile polynomially by a computer-generated ...

Abstract: The tilt of flip-chips is becoming increasingly important in optical and high-power electronic applications. This paper outlines the principal sources of tilt, and presents a mathematical algorithm ...