A Model for Deformation of Solder Bumps From Ramp LoadingSource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001::page 37Author:Lewis S. Goldmann
DOI: 10.1115/1.2792125Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability.
keyword(s): Deformation , Solders , Reliability , Algorithms , Design , Solder joints , Ball-Grid-Array packaging AND Flip-chip ,
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| contributor author | Lewis S. Goldmann | |
| date accessioned | 2017-05-08T23:49:50Z | |
| date available | 2017-05-08T23:49:50Z | |
| date copyright | March, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26153#37_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116795 | |
| description abstract | A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Model for Deformation of Solder Bumps From Ramp Loading | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792125 | |
| journal fristpage | 37 | |
| journal lastpage | 40 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Solders | |
| keywords | Reliability | |
| keywords | Algorithms | |
| keywords | Design | |
| keywords | Solder joints | |
| keywords | Ball-Grid-Array packaging AND Flip-chip | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001 | |
| contenttype | Fulltext |