Statistical Model for the Inherent Tilt of Flip-ChipsSource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001::page 16Author:Lewis S. Goldmann
DOI: 10.1115/1.2792120Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The tilt of flip-chips is becoming increasingly important in optical and high-power electronic applications. This paper outlines the principal sources of tilt, and presents a mathematical algorithm for the statistical variation in inherent tilt, the component related to variability of solder pad dimensions. With the assistance of a Monte Carlo simulation, closed form equations are developed for several common families of symmetric pad footprints. Possible extension of the analytical tools to other important cases is discussed.
keyword(s): Flip-chip devices , Solders , Dimensions , Simulation , Algorithms , Equipment and tools AND Equations ,
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| contributor author | Lewis S. Goldmann | |
| date accessioned | 2017-05-08T23:49:51Z | |
| date available | 2017-05-08T23:49:51Z | |
| date copyright | March, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26153#16_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116799 | |
| description abstract | The tilt of flip-chips is becoming increasingly important in optical and high-power electronic applications. This paper outlines the principal sources of tilt, and presents a mathematical algorithm for the statistical variation in inherent tilt, the component related to variability of solder pad dimensions. With the assistance of a Monte Carlo simulation, closed form equations are developed for several common families of symmetric pad footprints. Possible extension of the analytical tools to other important cases is discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Statistical Model for the Inherent Tilt of Flip-Chips | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792120 | |
| journal fristpage | 16 | |
| journal lastpage | 20 | |
| identifier eissn | 1043-7398 | |
| keywords | Flip-chip devices | |
| keywords | Solders | |
| keywords | Dimensions | |
| keywords | Simulation | |
| keywords | Algorithms | |
| keywords | Equipment and tools AND Equations | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001 | |
| contenttype | Fulltext |