Abstract: In orthogonal machining experiments on copper and aluminum in which chemical reagents were applied to the work surfaces and allowed to dry completely before cutting, it was found that tool ...

Abstract: The laminar free convection in a compound parabolic concentrator (CPC) solar collector cavity is numerically simulated using the finite element method. Results are presented for representative CPC ...

Abstract: The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ ...

Abstract: Delamination of interfaces in integrated circuit (IC) packages gives rise to electrical and mechanical failures such as popcorn cracking. Hence it is important to be able to analyze the mechanics ...

Abstract: An experimental study of the free convection heat transfer between the cylindrical absorber and the flat top of a compound parabolic concentrator (CPC) is described. Results are obtained for a ...

Abstract: During the transfer molding of IC packages, wirebonds are deformed by the action of flow-induced viscous forces acting along them. Excessive deformation of wirebonds could give rise to short ...

Abstract: The reliability of the flip chip package is strongly influenced by underfill, which has a much higher coefficient of thermal expansion (CTE) compared with other packaging materials and leads ...