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| Thermomechanical Finite Element Analysis of Cu–SiCN Hybrid Bonding With Protruding and Recessed Cu Pad in Three-Dimensional Integrated Circuits | 18 |
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| Thermomechanical Finite Element Analysis of Cu–SiCN Hybrid Bonding With Protruding and Recessed Cu Pad in Three-Dimensional Integrated Circuits | 0 | 0 | 0 | 3 | 6 | 7 | 2 |
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