• Login
    Statistics 
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • Statistics
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • Statistics
    JavaScript is disabled for your browser. Some features of this site may not work without it.
    Statistics

    Total Visits

    Views
    High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape29

    Total Visits Per Month

    May 2026June 2026July 2026August 2026September 2026October 2026November 2026
    High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape000311132

    File Visits

    Views

    Top country views

    Views
    Finland8
    United States5
    Vietnam2
    South Africa2
    Argentina1
    Brazil1
    Canada1
    United Kingdom1
    Italy1
    Japan1

    Top cities views

    Views
    Hanoi2
    Bangkok1
    Bosques1
    Caxias Do Sul1
    Espoo1
    Glossop1
    Helsinki1
    Johannesburg1
    Kisko1
    Lahti1

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV