Statistics
Total Visits
| Views | |
|---|---|
| Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate | 72 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate | 5 | 0 | 5 | 0 | 7 | 13 | 4 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 27 |
| China | 12 |
| Finland | 9 |
| Japan | 4 |
| France | 2 |
| Ukraine | 2 |
| Argentina | 1 |
| Brazil | 1 |
| Canada | 1 |
| Colombia | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 18 |
| Tianjin | 6 |
| Helsinki | 2 |
| Kumamoto | 2 |
| Orange | 2 |
| Tokyo | 2 |
| Aalsmeer | 1 |
| Beijing | 1 |
| Dong Nai | 1 |
| Jakarta | 1 |