| dc.contributor.author | Lee, H. T. | |
| dc.contributor.author | Ho, C. Y. | |
| dc.contributor.author | Lee, C. C. | |
| dc.date.accessioned | 2022-05-08T09:06:59Z | |
| dc.date.available | 2022-05-08T09:06:59Z | |
| dc.date.copyright | 10/6/2021 12:00:00 AM | |
| dc.date.issued | 2021 | |
| dc.identifier.issn | 1043-7398 | |
| dc.identifier.other | ep_144_04_041001.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4284745 | |
| dc.description.abstract | Effects of Ag content (0 ∼ 3 wt%) in Sn-xAgCu0.7 solders on microstructure characteristics and low cycling fatigue at different temperature conditions are overall investigated. To increase Ag content, the solidus points 228.8 °C of Sn-Cu0.7 gradually decrease to 218.5 °C and temperature range of solid–liquid coexistence phase reduces at the same time. The Sn-Cu0.7 matrix consisted of small particles of Cu6Sn5 within β-Sn equiaxial grains and did not significantly influence solder hardness. Moreover, much intermetallic compound of plate-like Ag3Sn and rod-like Cu6Sn5 existed in Sn-xAgCu0.7 solders enables to enhance the hardness due to dense network of Ag3Sn precipitation and near eutectic point. As a result of plastic displacement decreases with higher Ag additions, better fatigue lifetime could be achieved at Ag content to 1.5 wt%. Besides, crack stemmed from thicker intermetallic compounds (IMC) layer in Sn-3.0Ag-Cu0.7 solder interface will decrease fatigue performance especially for 80 °C and 120 °C. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging | |
| dc.type | Journal Paper | |
| dc.journal.volume | 144 | |
| dc.journal.issue | 4 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4052075 | |
| dc.journal.fristpage | 41001-1 | |
| dc.journal.lastpage | 41001-7 | |
| dc.page | 7 | |
| dc.tree | Journal of Electronic Packaging:;2021:;volume( 144 ):;issue: 004 | |
| dc.contenttype | Fulltext | |
