Statistics
Total Visits
| Views | |
|---|---|
| Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging | 46 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging | 0 | 0 | 0 | 2 | 3 | 8 | 3 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 14 |
| China | 11 |
| Brazil | 3 |
| United Arab Emirates | 2 |
| Finland | 2 |
| Japan | 2 |
| Argentina | 1 |
| Bangladesh | 1 |
| Belgium | 1 |
| Canada | 1 |
Top cities views
| Views | |
|---|---|
| Tianjin | 5 |
| Oakland | 4 |
| Changzhi | 3 |
| San Mateo | 3 |
| Abu Dhabi | 2 |
| Jacarei | 2 |
| Lanzhou | 2 |
| Tokyo | 2 |
| Atlanta | 1 |
| Djidiouia | 1 |