Statistics
Total Visits
| Views | |
|---|---|
| Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach | 53 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach | 1 | 0 | 0 | 3 | 12 | 7 | 2 |
File Visits
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Top country views
| Views | |
|---|---|
| United States | 17 |
| Japan | 12 |
| China | 7 |
| Finland | 3 |
| Australia | 2 |
| Bangladesh | 1 |
| Chile | 1 |
| Germany | 1 |
| United Kingdom | 1 |
| India | 1 |
Top cities views
| Views | |
|---|---|
| Tokyo | 12 |
| San Mateo | 7 |
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| Aalsmeer | 1 |
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| Delhi | 1 |
| Dhaka | 1 |