Statistics
Total Visits
| Views | |
|---|---|
| Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms | 49 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms | 4 | 0 | 0 | 1 | 6 | 12 | 1 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 24 |
| China | 11 |
| Finland | 6 |
| Ukraine | 2 |
| India | 1 |
| Mongolia | 1 |
| Nigeria | 1 |
| Oman | 1 |
| Sweden | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 8 |
| Tianjin | 6 |
| Oakland | 4 |
| Helsinki | 2 |
| West Chester | 2 |
| Ann Arbor | 1 |
| Bangalore | 1 |
| Cleveland | 1 |
| Dearborn | 1 |
| Duluth | 1 |