Erratum: â€œIdentifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Studyâ€‌ [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]

dc.contributor.author	Siow, K. S.
dc.contributor.author	Lin, Y. T.
dc.date.accessioned	2017-05-09T01:27:32Z
dc.date.available	2017-05-09T01:27:32Z
dc.date.issued	2016
dc.identifier.issn	1528-9044
dc.identifier.other	mats_138_04_041009.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/160827
dc.description.abstract	The corresponding author is K. S. Siow.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Erratum: â€œIdentifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Studyâ€‌ [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]
dc.type	Journal Paper
dc.journal.volume	138
dc.journal.issue	3
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4033633
dc.journal.fristpage	37001
dc.journal.lastpage	37001
dc.identifier.eissn	1043-7398
dc.tree	Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003
dc.contenttype	Fulltext