Statistics
Total Visits
| Views | |
|---|---|
| Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study†[ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069] | 28 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study†[ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069] | 3 | 0 | 1 | 0 | 2 | 2 | 0 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| China | 10 |
| United States | 10 |
| United Arab Emirates | 1 |
| Austria | 1 |
| Australia | 1 |
| Brazil | 1 |
| India | 1 |
| Poland | 1 |
| Ukraine | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 5 |
| Tianjin | 3 |
| Fuzhou | 2 |
| Abu Dhabi | 1 |
| Fremont | 1 |
| Hebei | 1 |
| Minto | 1 |
| Mountain View | 1 |
| Mumbai | 1 |
| Odessa | 1 |