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| A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate | 35 |
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| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
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| A New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate | 2 | 0 | 0 | 0 | 4 | 2 | 3 |
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