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| Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film Coated Copper Substrates as Heat Sink | 25 |
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| Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film Coated Copper Substrates as Heat Sink | 1 | 0 | 0 | 0 | 2 | 5 | 3 |
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