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Total Visits
| Views | |
|---|---|
| Solving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias | 49 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Solving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias | 1 | 0 | 1 | 0 | 5 | 12 | 0 |
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