Statistics
Total Visits
| Views | |
|---|---|
| Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping | 75 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping | 14 | 6 | 3 | 0 | 8 | 15 | 2 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| Japan | 20 |
| United States | 20 |
| Brazil | 8 |
| Argentina | 4 |
| Finland | 4 |
| Ukraine | 3 |
| Vietnam | 3 |
| Australia | 2 |
| China | 2 |
| Spain | 2 |
Top cities views
| Views | |
|---|---|
| Tokyo | 20 |
| Oakland | 4 |
| San Mateo | 4 |
| Dearborn | 2 |
| Hanoi | 2 |
| Menlo Park | 2 |
| Sao Bernardo Do Campo | 2 |
| Wilde | 2 |
| Aalsmeer | 1 |
| Ada | 1 |