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dc.contributor.authorShin-ichi Satake
dc.contributor.authorGaku Sorimachi
dc.contributor.authorTakahiro Kanai
dc.contributor.authorJun Taniguchi
dc.contributor.authorNoriyuki Unno
dc.date.accessioned2017-05-09T00:37:12Z
dc.date.available2017-05-09T00:37:12Z
dc.date.copyrightSeptember, 2010
dc.date.issued2010
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26306#031003_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/142943
dc.description.abstractA high time-resolution measurement of flow field in a glass plate with glass cover with two holes was done by a micro-DHPTV system. The two holes mentioned here were also inside the photo-curable resin. Particle measurement was carried out during a 2 s time period that covered the time it took for the curing of resin. This curing time was theoretically calculated from the irradiation flux of the Ultraviolet (UV) source employed in the experiment. Moreover, temperature dependence of photo-curable resin was evaluated by measuring the resin at changing temperatures. Consequently, the tracking of seeding particles could instantaneously be recorded. The 3-D displacements, obtained from the particles being tracked, took place primarily along the direction of the depth. These values were found to be in good agreement with the theoretically calculated displacement values obtained from UV irradiation flux. Moreover, the displacement during photo-curing appeared to be proportional to the increase in temperature.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThree-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4001854
dc.journal.fristpage31003
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsUltraviolet radiation
dc.keywordsGlass
dc.keywordsMeasurement
dc.keywordsParticulate matter
dc.keywordsCuring
dc.keywordsResins
dc.keywordsDisplacement
dc.keywordsMicrochannels AND Resolution (Optics)
dc.treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
dc.contenttypeFulltext


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