Statistics
Total Visits
| Views | |
|---|---|
| Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film | 39 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film | 0 | 3 | 3 | 3 | 3 | 4 | 1 |
File Visits
| Views |
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Top country views
| Views | |
|---|---|
| United States | 11 |
| China | 9 |
| Belgium | 3 |
| Chile | 2 |
| Japan | 2 |
| Vietnam | 2 |
| Argentina | 1 |
| Brazil | 1 |
| Colombia | 1 |
| United Kingdom | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 8 |
| Tianjin | 6 |
| Heverlee | 3 |
| Menlo Park | 2 |
| Santiago | 2 |
| Shanghai | 2 |
| Tokyo | 2 |
| Hanoi | 1 |
| Lima | 1 |
| Medellin | 1 |