Statistics
Total Visits
| Views | |
|---|---|
| Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization | 55 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization | 1 | 3 | 0 | 2 | 3 | 9 | 2 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| China | 16 |
| United States | 16 |
| Finland | 6 |
| Ukraine | 3 |
| Argentina | 2 |
| Australia | 2 |
| Albania | 1 |
| Belgium | 1 |
| Brazil | 1 |
| Ecuador | 1 |
Top cities views
| Views | |
|---|---|
| Tianjin | 16 |
| San Mateo | 6 |
| Oakland | 4 |
| Margaret River | 2 |
| Menlo Park | 2 |
| San Jose | 2 |
| Ada | 1 |
| Bawang | 1 |
| Bragado | 1 |
| Dnepropetrovsk | 1 |