Statistics
Total Visits
| Views | |
|---|---|
| Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill | 46 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill | 0 | 0 | 1 | 3 | 2 | 7 | 8 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 21 |
| Finland | 5 |
| Brazil | 4 |
| China | 4 |
| Japan | 4 |
| India | 1 |
| Sri Lanka | 1 |
| Mexico | 1 |
| Russia | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 9 |
| Oakland | 4 |
| Tianjin | 4 |
| Tokyo | 4 |
| Helsinki | 2 |
| Hortolandia | 2 |
| San Jose | 2 |
| Chicago | 1 |
| Espoo | 1 |
| Mawanella | 1 |