Statistics
Total Visits
| Views | |
|---|---|
| Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability | 56 |
Total Visits Per Month
| May 2026 | June 2026 | July 2026 | August 2026 | September 2026 | October 2026 | November 2026 | |
|---|---|---|---|---|---|---|---|
| Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability | 0 | 3 | 1 | 1 | 4 | 7 | 3 |
File Visits
| Views |
|---|
Top country views
| Views | |
|---|---|
| United States | 20 |
| China | 16 |
| Finland | 7 |
| Japan | 4 |
| Brazil | 2 |
| Vietnam | 2 |
| United Kingdom | 1 |
| Indonesia | 1 |
| Ukraine | 1 |
| Uzbekistan | 1 |
Top cities views
| Views | |
|---|---|
| San Mateo | 10 |
| Tianjin | 10 |
| Oakland | 4 |
| Tokyo | 4 |
| Menlo Park | 2 |
| Sacramento | 2 |
| Alcobaca | 1 |
| Ann Arbor | 1 |
| Forssa | 1 |
| Gloucester | 1 |